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Staff Eng. Thermo-Mechanical Design/Integration Group

?	Participated on cross-functional engineering team to build working proto-type thin film solar panels- involved in panel design, process flow, engineering builds, data analysis, failure analysis testing, reliability testing post build.  
?	Participated on cross-functional engineering team for sourcing, specifying, qualifying tool vendors. Responsible for managing Suppliers, schedule, risk mitigation, contingency planning, cost, resources, specifications, IAT/FAT acceptance testing, line integration.
?	Planned and coordinated engineering and prototype builds for equipment and product testing.  Performed product data analysis and reporting to management and peers.
?	Planned/transferred new processes/toolsets to manufacturing line with minimal impact to Production.
?	Managed CFT’s to troubleshoot equipment, increase tool uptime, designed experiments to increase module power from <45W to 85W, minimize scribe shunting, stabilize module performance and increase lines yields to > 90%.
?	Optimized product performance metrics (Pmp, Voc, Isc, Rs, FF and Rsh) utilizing JMP/ process DOEs.  Coordinated with upstream/downstream engineering to optimize product metrics and yields.

Product Development/Project Engineer

Led team of Engineers in design and completion of plug flow reactor for Honda Motor Corporation’s combustion studies program.
?	Played a pivotal leadership role in the start-up of a commercial chemical engineering laboratory (including experimental setup, data analysis, facility management, supplier contracts and vendor accounts) and help RES achieve additional funding through the National Science Foundation (NSF).
?	Enhanced troubleshooting skills- responsible for the following equipment setup: plug flow reactor, HP 5890 Gas Chromatograph, Data Acquisition (DAQ) system and LabView interface.

Project Engineer (year contract)

Technical Program Manager for overseas production of internal/OEM recording heads.  

Led Engineering teams to ensure low cost country (China) met Best-In-Class yields, quality, and timely delivery of STK’s recording heads through Six Sigma methodology.  Led cross functional teams on supplier scorecard summary and quarterly audits of manufacturing sites in China. 
?	Spearheaded Engineering activities on several Six Sigma Black Belt projects with overseas Suppliers to reduce STK’s recording head products’ susceptibility to ESD damage, improve product yields, and decrease manufacturing cycle times.  Supplier helical scan yields increased by 40% and SUN/STK’s production capacity increased by a factor of 25.  Supplier cycle times improved by an average of 15%.
?	Directed Engineering teams on one internal and four new OEM products from the development phase through the production ramp phase.  Tracked key Critical to Function (CTF’s) metrics on seven other internal and OEM programs currently in production.
?	Facilitated weekly conference calls with overseas Suppliers to constantly push for improved process capability and resolve program action items.  Ensured that key Post Wafer Supplier (PWS) deliverables were accomplished to keep Customer builds on schedule.	
?	Facilitated Quarterly Business Reviews (QBRs) with overseas Suppliers and Recording Head Senior Staff to review Supplier scorecard.  Coordinated with Logistics, Quality, and Engineering groups to decide each Supplier’s quarterly business allocation.   
?	Program Manager for OEM helical scan program.  Directed weekly technical con-call meetings to resolve Customer program issues.  Ensured experimental head builds were delivered and technical issues were resolved as program progressed through experimental drive phases to production ramp.

Senior Technical Program Manager

?	Developed chemical mechanical planarization (CMP) processes for all internal/OEM StorageTek tape products.  
?	Filed patent and trade secret applications. One patent and two trade secrets granted.
?	Achieved Six Sigma Black Belt certification.  Directed Black Belt Team responsible for increasing product yields by more than 30% and generating more than $10M in revenue- played a pivotal role in division exceeding its yearly revenue goal by $5M.
?	Performed process DOE’s (Minitab, JMP software), DMAIC, DFSS, FMEA, ANOVA, Kaizen. 
?	Supervised a team of Technicians and Operators across three shifts to perform DOE’s, facilitated experiments and troubleshot process issues through the production line to meet development timelines.
?	Process Integrator for three tape drive products.  Coordinated wafer builds, determined process flow and experiment requirements, ordered masks, and created supporting documentation.  Reacted to concerns raised by Design and troubleshot process/yield issues.  Continued to strive for increased process capability, cycle time reduction and yield increases.  
?	Supported Operations by maintaining capable CMP process systems, alumina deposition systems, optical measurement tools, profilometry tools, wafer cleaning systems, and failure analysis tools (Focused Ion Beam (FIB)/Scanning Electron Microscope (SEM)/Atomic Force Microscope (AFM)).  Performed product dispositions in addition to general troubleshooting.  Documented processes and trained Operators and Technicians on proper cleanroom/ESD/process protocol.

Wafer Process/Design Engineer

Find out detailed information about Brian Opansky Ph.D, Staff Eng. Thermo-Mechanical Design/Integration Group in Boulder, CO

Brian Opansky Ph.D: Staff Eng. Thermo-Mechanical Design/Integration Group in Boulder, CO

Brian Opansky Ph.D

Western Digital

Abound Solar

Reaction Engineering Services

Sun Microsystems/StorageTek

StorageTek (formerly Quantum)

University of Colorado at Boulder

University of Wisconsin-Milwaukee